| ■ 영문 제목 : Global Electrically Conductive Adhesives for Semiconductor Packaging Market Growth 2025-2031
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 | ■ 상품 코드 : LPI660YT3812
■ 조사/발행회사 : LP Information
■ 발행일 : 2025년 4월 ■ 페이지수 : 약120
■ 작성언어 : 영어
■ 보고서 형태 : PDF
■ 납품 방식 : E메일 (주문 후 2-3영업일)
■ 조사대상 지역 : 글로벌
■ 산업 분야 : 화학, 재료
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■ 판매가격 / 옵션 (부가세 10% 별도)
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반도체 패키징용 전기전도성 접착제(Electrically Conductive Adhesives, ECAs)는 반도체 장치 내에서 칩 및 기타 부품을 기판에 전기적으로 연결하고 고정하는 데 사용되는 특수 접착제로, 전기 및 열 전도성이 높고 접착력이 우수한 것이 특징입니다. 이러한 특성 덕분에 반도체 소자의 안정적인 전기 연결과 효과적인 열 방출을 동시에 구현할 수 있어, 고성능 전자기기의 신뢰성을 크게 높이는 핵심 소재로 주목받고 있습니다.
글로벌 ECAs 시장은 2025년 8억 9,400만 달러에서 2031년 13억 3,800만 달러로 성장할 전망이며, 이 기간 동안 연평균 성장률(CAGR)은 7.0%에 이를 것으로 예측됩니다. 특히 소비자 전자 및 자동차 전장 부문의 급성장과 고집적 반도체 패키징 수요 확대가 시장 성장을 주도하고 있습니다.
ECAs는 제품 형태에 따라 1액형, 2액형, 기타로 분류되며, 응용 분야는 소비자 전자, 자동차 전장, 기타 산업용 전자기기 등으로 다양합니다. 아시아 태평양, 미주, 유럽, 중동 및 아프리카 지역별로 세분화된 시장 분석이 제공되며, 특히 중국, 한국, 일본은 주요 생산 및 수요처로 부상하고 있습니다.
보고서에서는 Henkel, Heraeus, DOW, H.B. Fuller, Master Bond 등 주요 글로벌 기업들의 시장 점유율, 제품 포트폴리오, 지역 전략 등을 분석하였으며, M&A 동향, 제품 개발, 시장 진입 전략 등도 다루고 있습니다.
이 보고서는 유형 및 응용 분야별 시장 구조, 성장 요인, 제한 요인, 기술 트렌드 등을 종합적으로 분석하여, 반도체 산업 내 ECAs 시장의 향후 성장 가능성과 기회를 통찰력 있게 제시합니다. |
■ 보고서 개요The global Electrically Conductive Adhesives for Semiconductor Packaging market size is predicted to grow from US$ 894 million in 2025 to US$ 1338 million in 2031; it is expected to grow at a CAGR of 7.0% from 2025 to 2031.
Semiconductor packaging electrically conductive adhesives (ECAs) are specialized adhesives used for electrical connections and bonding within semiconductor packaging applications. These adhesives provide high electrical conductivity, thermal conductivity, and bonding strength. They are essential for ensuring reliable electrical connections and efficient heat dissipation in semiconductor devices.
United States market for Electrically Conductive Adhesives for Semiconductor Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Electrically Conductive Adhesives for Semiconductor Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Electrically Conductive Adhesives for Semiconductor Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Electrically Conductive Adhesives for Semiconductor Packaging players cover Henkel, Heraeus, DOW, H.B. Fuller, Master Bond, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ‘ newest research report, the “Electrically Conductive Adhesives for Semiconductor Packaging Industry Forecast” looks at past sales and reviews total world Electrically Conductive Adhesives for Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Electrically Conductive Adhesives for Semiconductor Packaging sales for 2025 through 2031. With Electrically Conductive Adhesives for Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electrically Conductive Adhesives for Semiconductor Packaging industry.
This Insight Report provides a comprehensive analysis of the global Electrically Conductive Adhesives for Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Electrically Conductive Adhesives for Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Electrically Conductive Adhesives for Semiconductor Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electrically Conductive Adhesives for Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electrically Conductive Adhesives for Semiconductor Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Electrically Conductive Adhesives for Semiconductor Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
One-part
Two-part
Others
Segmentation by Application:
Consumer Electronics
Automotive Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company’s coverage, product portfolio, its market penetration.
Henkel
Heraeus
DOW
H.B. Fuller
Master Bond
Panacol-Elosol
Epoxy Technology
DELO
Polytec PT
Wuxi DK Electronic
Yongoo Technology
Shanren New Material
NanoTop
Key Questions Addressed in this Report
What is the 10-year outlook for the global Electrically Conductive Adhesives for Semiconductor Packaging market?
What factors are driving Electrically Conductive Adhesives for Semiconductor Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Electrically Conductive Adhesives for Semiconductor Packaging market opportunities vary by end market size?
How does Electrically Conductive Adhesives for Semiconductor Packaging break out by Type, by Application?
■ 보고서 목차1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Electrically Conductive Adhesives for Semiconductor Packaging by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Electrically Conductive Adhesives for Semiconductor Packaging by Country/Region, 2020, 2024 & 2031
2.2 Electrically Conductive Adhesives for Semiconductor Packaging Segment by Type
2.2.1 One-part
2.2.2 Two-part
2.2.3 Others
2.3 Electrically Conductive Adhesives for Semiconductor Packaging Sales by Type
2.3.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Sales Market Share by Type (2020-2025)
2.3.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Revenue and Market Share by Type (2020-2025)
2.3.3 Global Electrically Conductive Adhesives for Semiconductor Packaging Sale Price by Type (2020-2025)
2.4 Electrically Conductive Adhesives for Semiconductor Packaging Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive Electronics
2.4.3 Others
2.5 Electrically Conductive Adhesives for Semiconductor Packaging Sales by Application
2.5.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Sale Market Share by Application (2020-2025)
2.5.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Revenue and Market Share by Application (2020-2025)
2.5.3 Global Electrically Conductive Adhesives for Semiconductor Packaging Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Breakdown Data by Company
3.1.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Sales by Company (2020-2025)
3.1.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Sales Market Share by Company (2020-2025)
3.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Revenue by Company (2020-2025)
3.2.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Revenue by Company (2020-2025)
3.2.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Revenue Market Share by Company (2020-2025)
3.3 Global Electrically Conductive Adhesives for Semiconductor Packaging Sale Price by Company
3.4 Key Manufacturers Electrically Conductive Adhesives for Semiconductor Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Electrically Conductive Adhesives for Semiconductor Packaging Product Location Distribution
3.4.2 Players Electrically Conductive Adhesives for Semiconductor Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Electrically Conductive Adhesives for Semiconductor Packaging by Geographic Region
4.1 World Historic Electrically Conductive Adhesives for Semiconductor Packaging Market Size by Geographic Region (2020-2025)
4.1.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Electrically Conductive Adhesives for Semiconductor Packaging Market Size by Country/Region (2020-2025)
4.2.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Sales by Country/Region (2020-2025)
4.2.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Electrically Conductive Adhesives for Semiconductor Packaging Sales Growth
4.4 APAC Electrically Conductive Adhesives for Semiconductor Packaging Sales Growth
4.5 Europe Electrically Conductive Adhesives for Semiconductor Packaging Sales Growth
4.6 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging Sales Growth
5 Americas
5.1 Americas Electrically Conductive Adhesives for Semiconductor Packaging Sales by Country
5.1.1 Americas Electrically Conductive Adhesives for Semiconductor Packaging Sales by Country (2020-2025)
5.1.2 Americas Electrically Conductive Adhesives for Semiconductor Packaging Revenue by Country (2020-2025)
5.2 Americas Electrically Conductive Adhesives for Semiconductor Packaging Sales by Type (2020-2025)
5.3 Americas Electrically Conductive Adhesives for Semiconductor Packaging Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Electrically Conductive Adhesives for Semiconductor Packaging Sales by Region
6.1.1 APAC Electrically Conductive Adhesives for Semiconductor Packaging Sales by Region (2020-2025)
6.1.2 APAC Electrically Conductive Adhesives for Semiconductor Packaging Revenue by Region (2020-2025)
6.2 APAC Electrically Conductive Adhesives for Semiconductor Packaging Sales by Type (2020-2025)
6.3 APAC Electrically Conductive Adhesives for Semiconductor Packaging Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Electrically Conductive Adhesives for Semiconductor Packaging by Country
7.1.1 Europe Electrically Conductive Adhesives for Semiconductor Packaging Sales by Country (2020-2025)
7.1.2 Europe Electrically Conductive Adhesives for Semiconductor Packaging Revenue by Country (2020-2025)
7.2 Europe Electrically Conductive Adhesives for Semiconductor Packaging Sales by Type (2020-2025)
7.3 Europe Electrically Conductive Adhesives for Semiconductor Packaging Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging by Country
8.1.1 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging Sales by Country (2020-2025)
8.1.2 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging Revenue by Country (2020-2025)
8.2 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging Sales by Type (2020-2025)
8.3 Middle East & Africa Electrically Conductive Adhesives for Semiconductor Packaging Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Electrically Conductive Adhesives for Semiconductor Packaging
10.3 Manufacturing Process Analysis of Electrically Conductive Adhesives for Semiconductor Packaging
10.4 Industry Chain Structure of Electrically Conductive Adhesives for Semiconductor Packaging
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Electrically Conductive Adhesives for Semiconductor Packaging Distributors
11.3 Electrically Conductive Adhesives for Semiconductor Packaging Customer
12 World Forecast Review for Electrically Conductive Adhesives for Semiconductor Packaging by Geographic Region
12.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Market Size Forecast by Region
12.1.1 Global Electrically Conductive Adhesives for Semiconductor Packaging Forecast by Region (2026-2031)
12.1.2 Global Electrically Conductive Adhesives for Semiconductor Packaging Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Electrically Conductive Adhesives for Semiconductor Packaging Forecast by Type (2026-2031)
12.7 Global Electrically Conductive Adhesives for Semiconductor Packaging Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Henkel
13.1.1 Henkel Company Information
13.1.2 Henkel Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.1.3 Henkel Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Henkel Main Business Overview
13.1.5 Henkel Latest Developments
13.2 Heraeus
13.2.1 Heraeus Company Information
13.2.2 Heraeus Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.2.3 Heraeus Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Heraeus Main Business Overview
13.2.5 Heraeus Latest Developments
13.3 DOW
13.3.1 DOW Company Information
13.3.2 DOW Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.3.3 DOW Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 DOW Main Business Overview
13.3.5 DOW Latest Developments
13.4 H.B. Fuller
13.4.1 H.B. Fuller Company Information
13.4.2 H.B. Fuller Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.4.3 H.B. Fuller Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 H.B. Fuller Main Business Overview
13.4.5 H.B. Fuller Latest Developments
13.5 Master Bond
13.5.1 Master Bond Company Information
13.5.2 Master Bond Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.5.3 Master Bond Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Master Bond Main Business Overview
13.5.5 Master Bond Latest Developments
13.6 Panacol-Elosol
13.6.1 Panacol-Elosol Company Information
13.6.2 Panacol-Elosol Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.6.3 Panacol-Elosol Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Panacol-Elosol Main Business Overview
13.6.5 Panacol-Elosol Latest Developments
13.7 Epoxy Technology
13.7.1 Epoxy Technology Company Information
13.7.2 Epoxy Technology Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.7.3 Epoxy Technology Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Epoxy Technology Main Business Overview
13.7.5 Epoxy Technology Latest Developments
13.8 DELO
13.8.1 DELO Company Information
13.8.2 DELO Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.8.3 DELO Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 DELO Main Business Overview
13.8.5 DELO Latest Developments
13.9 Polytec PT
13.9.1 Polytec PT Company Information
13.9.2 Polytec PT Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.9.3 Polytec PT Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Polytec PT Main Business Overview
13.9.5 Polytec PT Latest Developments
13.10 Wuxi DK Electronic
13.10.1 Wuxi DK Electronic Company Information
13.10.2 Wuxi DK Electronic Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.10.3 Wuxi DK Electronic Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Wuxi DK Electronic Main Business Overview
13.10.5 Wuxi DK Electronic Latest Developments
13.11 Yongoo Technology
13.11.1 Yongoo Technology Company Information
13.11.2 Yongoo Technology Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.11.3 Yongoo Technology Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Yongoo Technology Main Business Overview
13.11.5 Yongoo Technology Latest Developments
13.12 Shanren New Material
13.12.1 Shanren New Material Company Information
13.12.2 Shanren New Material Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.12.3 Shanren New Material Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Shanren New Material Main Business Overview
13.12.5 Shanren New Material Latest Developments
13.13 NanoTop
13.13.1 NanoTop Company Information
13.13.2 NanoTop Electrically Conductive Adhesives for Semiconductor Packaging Product Portfolios and Specifications
13.13.3 NanoTop Electrically Conductive Adhesives for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 NanoTop Main Business Overview
13.13.5 NanoTop Latest Developments
14 Research Findings and Conclusion
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