| ■ 영문 제목 : Global Epoxy Molding Compound (EMC) for Semiconductor Market Growth 2025-2031
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 | ■ 상품 코드 : LPI938JM884
■ 조사/발행회사 : LP Information
■ 발행일 : 2025년 2월
■ 페이지수 : 약140
■ 작성언어 : 영어
■ 보고서 형태 : PDF
■ 납품 방식 : E메일 (주문 후 2-3영업일)
■ 조사대상 지역 : 글로벌
■ 산업 분야 : 화학, 재료
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■ 판매가격 / 옵션 (부가세 10% 별도)
| Single User (1명 열람용) | USD3,660 ⇒환산￦5,124,000 | 견적의뢰/주문/질문 |
| Corporate User (동일기업내 공유가능) | USD7,320 ⇒환산￦10,248,000 | 견적의뢰/주문/질문 |
※가격옵션 설명
- 납기는 즉일~2일소요됩니다. 3일이상 소요되는 경우는 별도표기 또는 연락드립니다.
- 지불방법은 계좌이체/무통장입금 또는 카드결제입니다.
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에폭시 몰딩 컴파운드(EMC, Epoxy Molding Compound)는 반도체 패키징 공정에서 칩을 외부 환경으로부터 보호하는 재료로, 수분, 열, 충격 등의 요인으로부터 회로를 안전하게 감싸주는 기능을 합니다. 주성분은 에폭시 수지, 경화제, 실리카, 기타 첨가제로 구성되며, 반도체의 신뢰성과 수명을 향상시키는 데 필수적인 소재입니다.
글로벌 EMC 시장은 2025년부터 2031년까지 연평균 성장률(CAGR) xx%로 꾸준히 성장할 것으로 예측되며, 특히 IoT 기반 전자기기의 확산과 고성능 프로세서 수요 증가가 시장 성장을 견인하고 있습니다. 응용 분야로는 리드 프레임(DIS, DIP), 기판(BGA, CSP), 전력 반도체 등 다양한 반도체 패키징 기술에 활용됩니다.
제품 유형은 친환경 할로겐 프리 EMC, 저변형 EMC, 고열전도성 EMC 등으로 세분화되며, 고기능·고신뢰성 소재에 대한 수요가 확대되고 있습니다. 지역별로는 아시아 태평양(APAC)이 주요 생산 및 수요처로 부상하고 있으며, 미국, 유럽, 중동 및 아프리카에서도 수요가 증가하는 추세입니다.
본 보고서는 주요 제조사인 스미토모 베이크라이트, 히타치 케미컬, 삼성SDI, 신에츠화학, KCC, Panasonic, Chang Chun Group 등을 중심으로 EMC 산업의 경쟁 구도, 제품 포트폴리오, 지역 전략을 분석하고 있습니다. 또한, 미국의 관세 정책 및 이에 대한 글로벌 대응이 공급망과 시장 경쟁력에 미치는 영향도 종합적으로 다루고 있습니다.
이 인사이트 리포트는 EMC 시장의 기술 트렌드, 시장 기회, 주요 과제 등을 유형, 응용, 지역별로 상세히 분석하여 향후 시장의 변화 방향과 성장 가능성을 제시하고 있습니다. |
■ 보고서 개요The global Epoxy Molding Compound (EMC) for Semiconductor market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
EMC effectively protects semiconductor circuits from factors in the external environment such as moisture, heat, and shock. Its main ingredients are epoxy resin, hardener, silica, and other additives.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
LP Information, Inc. (LPI) ‘ newest research report, the “Epoxy Molding Compound (EMC) for Semiconductor Industry Forecast” looks at past sales and reviews total world Epoxy Molding Compound (EMC) for Semiconductor sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Molding Compound (EMC) for Semiconductor sales for 2025 through 2031. With Epoxy Molding Compound (EMC) for Semiconductor sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Molding Compound (EMC) for Semiconductor industry.
This Insight Report provides a comprehensive analysis of the global Epoxy Molding Compound (EMC) for Semiconductor landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Molding Compound (EMC) for Semiconductor portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Epoxy Molding Compound (EMC) for Semiconductor market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Molding Compound (EMC) for Semiconductor and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Molding Compound (EMC) for Semiconductor.
This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Molding Compound (EMC) for Semiconductor market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Standard (Halogen Free) Epoxy Molding Compound
Little Warpage Epoxy Molding Compound
High Thermal Epoxy Molding Compound
Segmentation by Application:
Lead Frame (DIS and DIP)
Substrate (BGA and CSP)
Power Devices
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company’s coverage, product portfolio, its market penetration.
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Epoxy Molding Compound (EMC) for Semiconductor market?
What factors are driving Epoxy Molding Compound (EMC) for Semiconductor market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Epoxy Molding Compound (EMC) for Semiconductor market opportunities vary by end market size?
How does Epoxy Molding Compound (EMC) for Semiconductor break out by Type, by Application?
■ 보고서 목차1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Epoxy Molding Compound (EMC) for Semiconductor by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Epoxy Molding Compound (EMC) for Semiconductor by Country/Region, 2020, 2024 & 2031
2.2 Epoxy Molding Compound (EMC) for Semiconductor Segment by Type
2.2.1 Standard (Halogen Free) Epoxy Molding Compound
2.2.2 Little Warpage Epoxy Molding Compound
2.2.3 High Thermal Epoxy Molding Compound
2.3 Epoxy Molding Compound (EMC) for Semiconductor Sales by Type
2.3.1 Global Epoxy Molding Compound (EMC) for Semiconductor Sales Market Share by Type (2020-2025)
2.3.2 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue and Market Share by Type (2020-2025)
2.3.3 Global Epoxy Molding Compound (EMC) for Semiconductor Sale Price by Type (2020-2025)
2.4 Epoxy Molding Compound (EMC) for Semiconductor Segment by Application
2.4.1 Lead Frame (DIS and DIP)
2.4.2 Substrate (BGA and CSP)
2.4.3 Power Devices
2.5 Epoxy Molding Compound (EMC) for Semiconductor Sales by Application
2.5.1 Global Epoxy Molding Compound (EMC) for Semiconductor Sale Market Share by Application (2020-2025)
2.5.2 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue and Market Share by Application (2020-2025)
2.5.3 Global Epoxy Molding Compound (EMC) for Semiconductor Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Epoxy Molding Compound (EMC) for Semiconductor Breakdown Data by Company
3.1.1 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Sales by Company (2020-2025)
3.1.2 Global Epoxy Molding Compound (EMC) for Semiconductor Sales Market Share by Company (2020-2025)
3.2 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Revenue by Company (2020-2025)
3.2.1 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue by Company (2020-2025)
3.2.2 Global Epoxy Molding Compound (EMC) for Semiconductor Revenue Market Share by Company (2020-2025)
3.3 Global Epoxy Molding Compound (EMC) for Semiconductor Sale Price by Company
3.4 Key Manufacturers Epoxy Molding Compound (EMC) for Semiconductor Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Epoxy Molding Compound (EMC) for Semiconductor Product Location Distribution
3.4.2 Players Epoxy Molding Compound (EMC) for Semiconductor Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 Market M&A Activity & Strategy
4 World Historic Review for Epoxy Molding Compound (EMC) for Semiconductor by Geographic Region
4.1 World Historic Epoxy Molding Compound (EMC) for Semiconductor Market Size by Geographic Region (2020-2025)
4.1.1 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Epoxy Molding Compound (EMC) for Semiconductor Market Size by Country/Region (2020-2025)
4.2.1 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Sales by Country/Region (2020-2025)
4.2.2 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Revenue by Country/Region (2020-2025)
4.3 Americas Epoxy Molding Compound (EMC) for Semiconductor Sales Growth
4.4 APAC Epoxy Molding Compound (EMC) for Semiconductor Sales Growth
4.5 Europe Epoxy Molding Compound (EMC) for Semiconductor Sales Growth
4.6 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor Sales Growth
5 Americas
5.1 Americas Epoxy Molding Compound (EMC) for Semiconductor Sales by Country
5.1.1 Americas Epoxy Molding Compound (EMC) for Semiconductor Sales by Country (2020-2025)
5.1.2 Americas Epoxy Molding Compound (EMC) for Semiconductor Revenue by Country (2020-2025)
5.2 Americas Epoxy Molding Compound (EMC) for Semiconductor Sales by Type (2020-2025)
5.3 Americas Epoxy Molding Compound (EMC) for Semiconductor Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Epoxy Molding Compound (EMC) for Semiconductor Sales by Region
6.1.1 APAC Epoxy Molding Compound (EMC) for Semiconductor Sales by Region (2020-2025)
6.1.2 APAC Epoxy Molding Compound (EMC) for Semiconductor Revenue by Region (2020-2025)
6.2 APAC Epoxy Molding Compound (EMC) for Semiconductor Sales by Type (2020-2025)
6.3 APAC Epoxy Molding Compound (EMC) for Semiconductor Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Epoxy Molding Compound (EMC) for Semiconductor by Country
7.1.1 Europe Epoxy Molding Compound (EMC) for Semiconductor Sales by Country (2020-2025)
7.1.2 Europe Epoxy Molding Compound (EMC) for Semiconductor Revenue by Country (2020-2025)
7.2 Europe Epoxy Molding Compound (EMC) for Semiconductor Sales by Type (2020-2025)
7.3 Europe Epoxy Molding Compound (EMC) for Semiconductor Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor by Country
8.1.1 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor Sales by Country (2020-2025)
8.1.2 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor Revenue by Country (2020-2025)
8.2 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor Sales by Type (2020-2025)
8.3 Middle East & Africa Epoxy Molding Compound (EMC) for Semiconductor Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers & Growth Opportunities
9.2 Market Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Epoxy Molding Compound (EMC) for Semiconductor
10.3 Manufacturing Process Analysis of Epoxy Molding Compound (EMC) for Semiconductor
10.4 Industry Chain Structure of Epoxy Molding Compound (EMC) for Semiconductor
11 Marketing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Epoxy Molding Compound (EMC) for Semiconductor Distributors
11.3 Epoxy Molding Compound (EMC) for Semiconductor Customer
12 World Forecast Review for Epoxy Molding Compound (EMC) for Semiconductor by Geographic Region
12.1 Global Epoxy Molding Compound (EMC) for Semiconductor Market Size Forecast by Region
12.1.1 Global Epoxy Molding Compound (EMC) for Semiconductor Forecast by Region (2026-2031)
12.1.2 Global Epoxy Molding Compound (EMC) for Semiconductor Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Epoxy Molding Compound (EMC) for Semiconductor Forecast by Type (2026-2031)
12.7 Global Epoxy Molding Compound (EMC) for Semiconductor Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Sumitomo Bakelite
13.1.1 Sumitomo Bakelite Company Information
13.1.2 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.1.3 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Sumitomo Bakelite Main Business Overview
13.1.5 Sumitomo Bakelite Latest Developments
13.2 Hitachi Chemical
13.2.1 Hitachi Chemical Company Information
13.2.2 Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.2.3 Hitachi Chemical Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Hitachi Chemical Main Business Overview
13.2.5 Hitachi Chemical Latest Developments
13.3 Chang Chun Group
13.3.1 Chang Chun Group Company Information
13.3.2 Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.3.3 Chang Chun Group Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Chang Chun Group Main Business Overview
13.3.5 Chang Chun Group Latest Developments
13.4 Hysol Huawei Electronics
13.4.1 Hysol Huawei Electronics Company Information
13.4.2 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.4.3 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Hysol Huawei Electronics Main Business Overview
13.4.5 Hysol Huawei Electronics Latest Developments
13.5 Panasonic
13.5.1 Panasonic Company Information
13.5.2 Panasonic Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.5.3 Panasonic Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Panasonic Main Business Overview
13.5.5 Panasonic Latest Developments
13.6 Kyocera
13.6.1 Kyocera Company Information
13.6.2 Kyocera Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.6.3 Kyocera Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Kyocera Main Business Overview
13.6.5 Kyocera Latest Developments
13.7 KCC
13.7.1 KCC Company Information
13.7.2 KCC Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.7.3 KCC Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 KCC Main Business Overview
13.7.5 KCC Latest Developments
13.8 Samsung SDI
13.8.1 Samsung SDI Company Information
13.8.2 Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.8.3 Samsung SDI Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Samsung SDI Main Business Overview
13.8.5 Samsung SDI Latest Developments
13.9 Eternal Materials
13.9.1 Eternal Materials Company Information
13.9.2 Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.9.3 Eternal Materials Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Eternal Materials Main Business Overview
13.9.5 Eternal Materials Latest Developments
13.10 Jiangsu Zhongpeng New Material
13.10.1 Jiangsu Zhongpeng New Material Company Information
13.10.2 Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.10.3 Jiangsu Zhongpeng New Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Jiangsu Zhongpeng New Material Main Business Overview
13.10.5 Jiangsu Zhongpeng New Material Latest Developments
13.11 Shin-Etsu Chemical
13.11.1 Shin-Etsu Chemical Company Information
13.11.2 Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.11.3 Shin-Etsu Chemical Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 Shin-Etsu Chemical Main Business Overview
13.11.5 Shin-Etsu Chemical Latest Developments
13.12 Hexion
13.12.1 Hexion Company Information
13.12.2 Hexion Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.12.3 Hexion Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 Hexion Main Business Overview
13.12.5 Hexion Latest Developments
13.13 Nepes
13.13.1 Nepes Company Information
13.13.2 Nepes Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.13.3 Nepes Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.13.4 Nepes Main Business Overview
13.13.5 Nepes Latest Developments
13.14 Tianjin Kaihua Insulating Material
13.14.1 Tianjin Kaihua Insulating Material Company Information
13.14.2 Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.14.3 Tianjin Kaihua Insulating Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.14.4 Tianjin Kaihua Insulating Material Main Business Overview
13.14.5 Tianjin Kaihua Insulating Material Latest Developments
13.15 HHCK
13.15.1 HHCK Company Information
13.15.2 HHCK Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.15.3 HHCK Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.15.4 HHCK Main Business Overview
13.15.5 HHCK Latest Developments
13.16 Scienchem
13.16.1 Scienchem Company Information
13.16.2 Scienchem Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.16.3 Scienchem Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.16.4 Scienchem Main Business Overview
13.16.5 Scienchem Latest Developments
13.17 Beijing Sino-tech Electronic Material
13.17.1 Beijing Sino-tech Electronic Material Company Information
13.17.2 Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Product Portfolios and Specifications
13.17.3 Beijing Sino-tech Electronic Material Epoxy Molding Compound (EMC) for Semiconductor Sales, Revenue, Price and Gross Margin (2020-2025)
13.17.4 Beijing Sino-tech Electronic Material Main Business Overview
13.17.5 Beijing Sino-tech Electronic Material Latest Developments
14 Research Findings and Conclusion
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